Methods, apparatuses and systems for a combined temperature and pressure sensing device

ABSTRACT

Example methods, apparatuses and systems for a combined temperature and pressure sensing device are provided. An example apparatus includes a media isolation chamber assembly having a sleeve member and a bellows member, a first circuit board element disposed in the bellows member and encapsulated by insulator media in the bellows member, a pressure sensing element disposed in the bellows member and electrically coupled to the first circuit board element; and a temperature sensing element disposed in the sleeve member and electrically coupled to the first circuit board element.

BACKGROUND

Applicant has identified many technical deficiencies and problemsassociated with existing sensors.

BRIEF SUMMARY

Various embodiments described herein relate to methods, apparatuses, andsystems for providing a combined temperature and pressure sensingdevice.

In accordance with various embodiments of the present disclosure, anexample apparatus for sensing pressure and temperature may be provided.The example apparatus may comprise an example media isolation chamberassembly, a first example circuit board element, an example pressuresensing element, and an example temperature sensing element.

In some embodiments, the example media isolation chamber assembly maycomprise an example sleeve member and an example bellows member. In someembodiments, the example bellows member may be disposed in the examplesleeve member. In some embodiments, the example bellows member may houseexample insulator media.

In some embodiments, the first example circuit board element may bedisposed in the example bellows member. In some embodiments, the firstexample circuit board element may be encapsulated by the exampleinsulator media.

In some embodiments, the example pressure sensing element may bedisposed in the example bellows member. In some embodiments, the examplepressure sensing element may be electrically coupled to the firstexample circuit board element.

In some embodiments, the example temperature sensing element may bedisposed in the example sleeve member. In some embodiments, the exampletemperature sensing element may be electrically coupled to the firstexample circuit board element.

In some embodiments, the example bellows member may be hermeticallysealed to the example sleeve member.

In some embodiments, the example sleeve member may comprise an examplebody portion and an example probe portion. In some embodiments, theexample body portion may comprise an example side section and an exampleend section. In some embodiments, the example side section may be in anexample perpendicular arrangement with the example end section.

In some embodiments, the example probe portion may protrude from anouter surface of the example end section of the example body portion ofthe example sleeve member.

In some embodiments, the example temperature sensing element may bedisposed in the example probe portion of the example sleeve member.

In some embodiments, the example bellows member may be disposed in theexample body portion of the example sleeve member.

In some embodiments, the example end section may comprise at least oneexample media opening that may be configured to receive an exampleliquid substance so that the example liquid substance may be in contactwith the example bellows member.

In some embodiments, the first example circuit board element may extendfrom within the example bellows member to within the example probeportion of the example sleeve member.

In some embodiments, the apparatus may comprise an example portassembly. In some embodiments, the example sleeve member of the examplemedia isolation chamber assembly may be secured to an example outersurface of the example port assembly.

In some embodiments, the example port assembly may comprise an exampletunnel connecting a first example opening on the example outer surfaceof the example port assembly to a second example opening on an exampleinner surface of the example port assembly.

In some embodiments, the example tunnel may be configured to convey theexample insulator media to the example bellows member of the examplemedia isolation chamber assembly through the first example opening onthe example outer surface of the example port assembly.

In some embodiments, the example apparatus may comprise an examplesealing member covering the second example opening on the example innersurface of the example port assembly.

In some embodiments, the example apparatus may comprise a second examplecircuit board element disposed within the example port assembly.

In some embodiments, the apparatus may comprise at least one exampleterminal connector element electrically connecting the first examplecircuit board element to the second example circuit board element.

In some embodiments, the apparatus may comprise an example header membercomprising an example glass-to-metal seal portion. In some embodiments,the example header member may be secured to the first example circuitboard element and the example port assembly.

In some embodiments, the first example circuit board element maycomprise an example signal conditioning element. In some embodiments,the example pressure sensing element may be electronically coupled tothe example signal conditioning element.

In some embodiments, the example signal conditioning element may beconfigured to output an example electrical signal indicating an exampledetected pressure.

In some embodiments, the first example circuit board element maycomprise an example signal amplifying element. In some embodiments, theexample temperature sensing element may be electrically coupled to theexample signal amplifying element.

In some embodiments, the first example circuit board element maycomprise an example resistor element. In some embodiments, the exampleresistor element may be electrically coupled to the example temperaturesensing element and the example signal amplifying element.

In some embodiments, the example signal amplifying element may beconfigured to output an example electrical signal indicating an exampledetected temperature.

In some embodiments, the first example circuit board element may beconfigured to output a first example electrical signal indicating anexample detected pressure and a second example electrical signalindicating an example detected temperature.

The foregoing illustrative summary, as well as other exemplaryobjectives and/or advantages of the disclosure, and the manner in whichthe same are accomplished, are further explained in the followingdetailed description and its accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The description of the illustrative embodiments may be read inconjunction with the accompanying figures. It will be appreciated that,for simplicity and clarity of illustration, elements illustrated in thefigures have not necessarily been drawn to scale, unless describedotherwise. For example, the dimensions of some of the elements may beexaggerated relative to other elements, unless described otherwise.Embodiments incorporating teachings of the present disclosure are shownand described with respect to the figures presented herein, in which:

FIG. 1A illustrates an example cross-sectional front view of an exampleapparatus for sensing pressure and temperature in accordance withvarious embodiments of the present disclosure;

FIG. 1B illustrates an example cross-sectional side view of an exampleapparatus for sensing pressure and temperature in accordance withvarious embodiments of the present disclosure;

FIG. 2A illustrates an example front view of an example apparatus forsensing pressure and temperature in accordance with various embodimentsof the present disclosure;

FIG. 2B illustrates an example cross-sectional view of an example mediaisolation chamber assembly in accordance with various embodiments of thepresent disclosure;

FIG. 2C illustrates an example cross-sectional view of an example mediaisolation chamber assembly in accordance with various embodiments of thepresent disclosure;

FIG. 3 illustrates an example circuit diagram associated with an exampleapparatus for sensing pressure and temperature in accordance withvarious embodiments of the present disclosure;

FIG. 4 illustrates an example pressure sensing element in accordancewith various embodiments of the present disclosure; and

FIG. 5 illustrates an example circuit diagram associated with an examplepressure sensing element in accordance with various embodiments of thepresent disclosure.

DETAILED DESCRIPTION OF THE INVENTION

Some embodiments of the present disclosure will now be described morefully hereinafter with reference to the accompanying drawings, in whichsome, but not all embodiments of the disclosure are shown. Indeed, thesedisclosures may be embodied in many different forms and should not beconstrued as limited to the embodiments set forth herein; rather, theseembodiments are provided so that this disclosure will satisfy applicablelegal requirements. Like numbers refer to like elements throughout.

The phrases “in one embodiment,” “according to one embodiment,” and thelike generally mean that the particular feature, structure, orcharacteristic following the phrase may be included in at least oneembodiment of the present disclosure, and may be included in more thanone embodiment of the present disclosure (importantly, such phrases donot necessarily refer to the same embodiment).

The words “example” or “exemplary” are used herein to mean “serving asan example, instance, or illustration.” Any implementation describedherein as “exemplary” is not necessarily to be construed as preferred oradvantageous over other implementations.

If the specification states a component or feature “may,” “can,”“could,” “should,” “would,” “preferably,” “possibly,” “typically,”“optionally,” “for example,” “often,” or “might” (or other suchlanguage) be included or have a characteristic, that a specificcomponent or feature is not required to be included or to have thecharacteristic. Such component or feature may be optionally included insome embodiments, or it may be excluded.

The terms “electronically coupled,” “electrically coupled,”“electronically connected,” or “electrically connected” in the presentdisclosure refer to two or more electrical elements (for example but notlimited to, resistor element(s), capacitor element(s), inductorelement(s), diode element(s)) and/or electric circuit(s) being connectedthrough wired means (for example but not limited to, conductive wires ortraces) and/or wireless means (for example but not limited to,electromagnetic field), such that energy (for example but not limited toelectric current), signals, data and/or information may be transmittedto and/or received from the electrical elements and/or electriccircuit(s) that are electronically coupled.

The term “element” in the present disclosure refers to one or moreseparable electronic component(s) or independent electronic unit(s) thatmay be used to form, construct, or otherwise be part of an electronicsystem. In some embodiments, an element may comprise one or moreelectronic device(s) or physical entity/entities that may provide one ormore particular functions to the electronic system.

The term “pressure sensing element” in the present disclosure refers toan element that detects, senses, and/or measures the pressure of gaseoussubstance and/or liquid substance. In some embodiments, the pressuresensing element converts detected pressure into an analogues electricalsignal. In some embodiments, an example pressure sensing element inaccordance with various embodiments of the present disclosure may be amicro-electromechanical system (MEMS) pressure sensing die that is builtand packaged using MEMS techniques.

For example, an example pressure sensing element in accordance withvarious embodiments of the present disclosure is an example MEMSpiezoresistive pressure sensor die. In this example, the example MEMSpiezoresistive pressure sensor die may convert a pressure differencedetected on a diaphragm into an electrical signal. Referring now to FIG.4, an example pressure sensing element 400 is provided. In the exampleshown in FIG. 4, the example pressure sensing element 400 is in the formof an example MEMS piezoresistive pressure sensor die.

As shown in FIG. 4, the example pressure sensing element 400 comprises asubstrate 402, a diaphragm 404, and a plurality of piezoresistors (forexample, four piezoresistors including a piezoresistor 406A and apiezoresistor 406B).

In some embodiments, the substrate 402 comprises material such as, butnot limited to, glass, metal, and/or the like. In some embodiments, thesubstrate 402 comprises one or more materials that have similar thermalproperties as the diaphragm 404.

In some embodiments, the diaphragm 404 is bonded onto the substrate 402.In some embodiments, the diaphragm 404 may comprise material such as,but not limited to, silicon. In some embodiments, the diaphragm 404 maybe formed through a chemical etching process. For example, baths ofetching chemicals may be applied on the silicon material of thediaphragm 404, forming a cavity 408.

In some embodiments, the example pressure sensing element 400 detects,senses, and/or measures pressure applied on the outer surface 410 of thediaphragm 404. For example, a plurality of piezoresistors (for example,four piezoresistors including the piezoresistor 406A and thepiezoresistor 406B) may be embedded on the outer surface 410 of thediaphragm 404 (and/or within the diaphragm 404). In the presentdisclosure, a piezoresistor refers to a resistor that exhibits a changein its electrical resistance when mechanical strain or stress is appliedon the resistor.

In some embodiments, when the outer surface 410 of the diaphragm 404 isin contact with gaseous substance and/or liquid substance whose pressureis to be detected, sensed, and/or measured, the gaseous substance and/orliquid substance exerts pressure on outer surface 410 of the diaphragm404, and the diaphragm 404 flexes away from the pressure (for example,towards the cavity 408), causing strain in the plurality ofpiezoresistors (for example, four piezoresistors including thepiezoresistor 406A and the piezoresistor 406B) that are embedded on thediaphragm 404. In some embodiments, the four piezoresistors areelectrically coupled to an electrical circuit (such as a Wheatstonebridge circuit). Referring now to FIG. 5, an example circuit diagramassociated with an example pressure sensing element in accordance withvarious embodiments of the present disclosure is illustrated.

In the example shown in FIG. 5, the four piezoresistors disposed on theouter surface of the diaphragm of the pressure sensing element arerepresented as R₁, R₂, R₃, and R₄. In some embodiments, R₁, R₂, R₃, andR₄ are electrically coupled to a Wheatstone bridge circuit. Inparticular, R₁ and R₂ may be electrically coupled to a first bridgebranch of the Wheatstone bridge circuit between point A and point B asshown in FIG. 5, and R₃ and R₄ may be electrically coupled to a secondbridge branch of the Wheatstone bridge circuit between point A and pointB as shown in FIG. 5.

As described above, when pressure is applied on the outer surface of thediaphragm (for example, by gaseous substance and/or liquid substancewhose pressure is to be detected, sensed, and/or measured), thepiezoresistors R₁, R₂, R₃, and/or R₄ can be strained, which can causeone or more changes in one or more electrical resistances of R₁, R₂, R₃,and/or R₄. As shown in the example circuit diagram 500 illustrated inFIG. 5, a bias voltage V_(s) can be applied to the Wheatstone bridgecircuit between point A and point B. Because of the one or more changesin one or more electrical resistances of R₁, R₂, R₃, and/or R₄, thevoltage difference V_(out) between voltage V_(c) at point C of theWheatstone bridge circuit (which is between R₁ and R₂) and voltage V_(d)at point D of the Wheatstone bridge circuit (which is between R₃ and R₄)may change. In some embodiments, the change in the voltage differenceV_(out) corresponds to the pressure received on the outer surface of thediaphragm and exerted by the gaseous substance and/or liquid substance.As such, an example pressure sensing element in the form of an exampleMEMS piezoresistive pressure sensor die detects, senses, and/or measuresthe pressure of gaseous substance and/or liquid substance by generatingan electrical signal corresponding to the voltage difference V_(out).

While the description above provides an example of a pressure sensingelement in the form of an example MEMS piezoresistive pressure sensordie in accordance with various embodiments of the present disclosure, itis noted that the scope of the present disclosure is not limited to thedescription above. In some examples, an example pressure sensing elementmay comprise one or more additional and/or alternative components, maybe in one or more different forms, and/or may measure one or moredifferent types of pressure.

For example, in some embodiments, an example pressure sensing element inaccordance with example embodiments of the present disclosure is in theform of a MEMS capacitive pressure sensor. Additionally, oralternatively, in some embodiments, an example pressure sensing elementin accordance with example embodiments of the present disclosure is inthe form of a potentiometric pressure sensor. Additionally, oralternatively, in some embodiments, an example pressure sensing elementin accordance with example embodiments of the present disclosure is inthe form of an inductive pressure sensor. Additionally, oralternatively, in some embodiments, an example pressure sensing elementin accordance with example embodiments of the present disclosure is inthe form of a variable reluctance pressure sensor. Additionally, oralternatively, in some embodiments, an example pressure sensing elementin accordance with example embodiments of the present disclosure is inthe form of an absolute pressure sensor. Additionally, or alternatively,in some embodiments, an example pressure sensing element in accordancewith example embodiments of the present disclosure is in the form of agauge sensor. Additionally, or alternatively, in some embodiments, anexample pressure sensing element in accordance with example embodimentsof the present disclosure is in the form of a differential pressuresensor.

The term “temperature sensing element” in the present disclosure refersto an element that detects, senses, and/or measures the temperature ofgaseous substance and/or liquid substance. In some embodiments, thetemperature sensing element converts detected temperature into ananalogues electrical signal.

For example, an example temperature sensing element in accordance withvarious embodiments of the present disclosure is an example diode (forexample, but not limited to, an example P-N junction diode, an exampleZt diode). When a constant current is applied to the example diode, thevoltage across the example diode (for example, the voltage between theP-N junction) is affected by the temperature of the environment that theexample diode is in. As an example, when the example diode is in contactwith (or through insulator media that is in contact with) the gaseoussubstance and/or liquid substance whose temperate is to be detected,sensed, and/or measured, the temperature of the gaseous substance and/orliquid substance may affect the voltage across the example diode. Insome embodiments, when the temperature increases, the voltage across theexample diode decreases. In some embodiments, when the temperaturedecreases, the voltage across the example diode increases.

In some embodiments, the example diode may have a temperaturecoefficient between 1 mV/° C. and 2 mV/° C. In some embodiments, theexample diode may have a temperature coefficient of 2 mV/° C. Forexample, when the example diode has a temperature coefficient of 2 mV/°C., the voltage across the example diode decreases by 2 mV when thetemperature of the gaseous substance and/or liquid substance increasesby 1° C. In some embodiments, the example diode may have a temperaturecoefficient of other value(s) and/or within other range(s).

As such, an example temperature sensing element in the form of anexample diode detects, senses, and/or measures the temperature ofgaseous substance and/or liquid substance by generating an electricalsignal corresponding to the voltage across the diode.

While the description above provides an example of a temperature sensingelement in the form of an example diode in accordance with variousembodiments of the present disclosure, it is noted that the scope of thepresent disclosure is not limited to the description above. In someexamples, an example temperature sensing element may comprise one ormore additional and/or alternative components, may be in one or moredifferent forms, and/or may measure one or more different types oftemperature.

For example, in some embodiments, an example temperature sensing elementin accordance with example embodiments of the present disclosure is inthe form of a thermocouple. Additionally, or alternatively, in someembodiments, an example temperature sensing element in accordance withexample embodiments of the present disclosure is in the form of aresistance temperature detector (RTD). Additionally, or alternatively,in some embodiments, an example temperature sensing element inaccordance with example embodiments of the present disclosure is in theform of a thermistor. Additionally, or alternatively, in someembodiments, an example temperature sensing element in accordance withvarious embodiments of the present disclosure is a MEMS temperaturesensing die that is built and packaged using MEMS techniques.

The term “signal conditioning element” in the present disclosure refersto an element that adjusts, manipulates, and/or otherwise conditions ananalogues signal (such as an analogues electrical signal) so that theanalogues signal meets certain processing requirements of electronicsystem. In some embodiments, an example signal conditioning element inaccordance with various embodiments of the present disclosure may be anexample Application Specific Integrated Circuit (ASIC). In someembodiments, the example ASIC may include one or more microprocessorselectrically coupled to one or more memory units (such as, but notlimited to, random-access memory (RAM), read-only memory (ROM), flashmemory, and/or the like). In some embodiments, the one or moremicroprocessors of the example ASIC adjust, manipulate, and/or otherwisecondition an analogues signal, and output theadjusted/manipulated/conditioned signal to the electronic system.

While the description above provides an example of a signal conditioningelement, it is noted that the scope of the present disclosure is notlimited to the description above. In some examples, an example signalconditioning element may comprise one or more additional and/oralternative components and/or may be in one or more different forms. Forexample, in some embodiments, an example signal conditioning element inaccordance with example embodiments of the present disclosure is in theform of an analog-to-digital converter (ADC). The example ADC convertsan analogues signal (such as an analogues electrical signal) into adigital signal.

The term “signal amplifying element” in the present disclosure refers toan element that increases, expands, and/or otherwise amplifies a signal(such as, but not limited to, an analogues electrical signal). In someembodiments, an example signal amplifying element in accordance withvarious embodiments of the present disclosure may be an exampleinstrumentation amplifier (INA). In such embodiments, the example INAcomprises three operational amplifiers, where a non-inverting amplifieris connected to each input of a differential amplifier.

While the description above provides an example of a signal amplifyingelement, it is noted that the scope of the present disclosure is notlimited to the description above. In some examples, an example signalamplifying element may comprise one or more additional and/oralternative components, and/or may be in one or more different forms.

The term “resistor element” in the present disclosure refers to anelement that creates electrical resistance in the flow of electriccurrent. In some embodiments, an example resistor element in accordancewith example embodiments of the present disclosure is an exampleresistor. In such an example, the example resistor may reduce electriccurrent flow, divide electrical voltage, adjust electrical signallevels, and/or the like.

While the description above provides an example of a resistor element,it is noted that the scope of the present disclosure is not limited tothe description above. In some examples, an example resistor element maycomprise one or more additional and/or alternative components and/or maybe in one or more different forms.

The term “circuit board element” in the present disclosure refers to anelement that mechanically supports and electrically connects electricalcomponents or electronic components, including but not limited to,pressure sensing element(s), temperature sensing element(s), signalconditioning element(s), signal amplifying element(s), resistorelement(s), terminal connector element(s), power source(s), and/or thelike. In some embodiments, an example circuit board element may be inthe form of an example printed circuit board (PCB). In such an example,the example PCB may comprise a non-conductive substrate and conductivetracks, pads and other features that are formed and/or printed on thenon-conductive substrate (for example, through a chemical etchingprocess).

In some embodiments, one or more other elements (such as, but notlimited to, pressure sensing element(s), temperature sensing element(s),signal conditioning element(s), signal amplifying element(s), resistorelement(s), terminal connector element(s), power source(s), and/or thelike) are installed (for example, through a soldering process) onto theexample PCB so that each of these elements is electrically coupled toone or more other elements and mechanically fastened onto the examplePCB. In the present disclosure, an example PCB is also referred to as aprinted circuit board assembly (PCBA).

While the description above provides an example of a circuit boardelement, it is noted that the scope of the present disclosure is notlimited to the description above. In some examples, an example circuitboard element may comprise one or more additional and/or alternativecomponents and/or may be in one or more different forms.

The term “terminal connector element” in the present disclosure refersto an element that mechanically and/or electrically connects one circuitboard element with another circuit board element. For example, anexample terminal connector element in accordance with exampleembodiments of the present disclosure is in the form of an exampleelectrical connector (such as, but not limited to, an example metri-packconnector). In such an example, the example electrical connection maycomprise material such as, but not limited to, copper alloys, brass,nickel, and/or the like.

While the description above provides an example of a terminal connectorelement, it is noted that the scope of the present disclosure is notlimited to the description above. In some examples, an example terminalconnector element may comprise one or more additional and/or alternativecomponents, and/or may be in one or more different forms.

The term “member” in the present disclosure refers to a mechanical andphysical structure or unit can be used to form, construct, or otherwisebe part of an apparatus, a machine, a device, and/or the like. Examplemembers in the present disclosure include, but not limited to, sleevemember, bellows member, sealing member, header member, and/or the like.The structural details and features of these members are described andillustrated in connection with various drawings of the presentdisclosure.

As described above, there are many technical deficiencies and problemsassociated with sensors. For example, in many applications such as, butnot limited to, electric vehicles, refrigeration systems, compressorsystems, pumping systems, and/or the like, there is a need for a singlesensing solution that detects, senses, and/or measures both pressure andtemperature together in the same package in order to satisfy, forexample, regulatory requirements, efficiency goals, and/or otherobjectives.

As an example, one of the key challenges in plug-in electric vehicle(PEV) is the time required for charging the battery cells/packs of thePEV and the availability of power outlets/chargers that providesufficient capabilities in charging the battery cells/packs. The Societyof Automotive Engineers classified charging stations/poweroutlets/chargers for PEVs into three levels: level 1, level 2 and level3.

A level 1 charging station/power outlet/charger uses a standard 120 Valternating current (AC) electric circuit. The typical charging time forcharging a PEV by a level 1 charging station/power outlet/charger isapproximately 8 to 10 hours (depending on the model of the PEV), andprovides approximately 2 to 5 miles of range per hour of charging.

A level 2 charging station/power outlet/charger uses a 240 V (forresidential) or 208 V (for commercial) AC electric circuit. The typicalcharging time for charging a PEV by a level 2 charging station/poweroutlet/charger is approximately 4 to 8 hours (depending on the model ofthe PEV), and provides approximately 10-20 miles of range per hour ofcharging.

A level 3 (or direct current (DC) fast charge) charging station/poweroutlet/charger uses a 480 V AC electric circuit, and converts the ACinto DC. The typical charging time for charging a PEV by a level 3charging station/power outlet/charger is approximately 30 to 60 minutes(depending on the model of the PEV), and provides approximately 60-80miles of range per hour of charging.

As illustrated in the different charging times of a level 1 chargingstation/power outlet/charger, a level 2 charging station/poweroutlet/charger, and a level 3 charging station/power outlet/charger,higher power decreases charging time and makes charging a PEV faster.However, providing higher power to a PEV also generates more heat in thecharging station/power outlet/charger, onboard battery cells/packs ofthe PEV, and/or charging cables. For example, extreme fast chargers canpush the temperature of battery cells/packs in a PEV to 270° C. or 514°F. after just a few minutes of charging. The heat generated fromcharging requires advanced cooling techniques to promote safe andreliable operation.

Due to the limitations of air-cooling solutions, liquid coolingsolutions can be implemented in EV and PEV for enabling efficientperformance and safe operations of onboard battery cells/packs, chargingcables, and/or and other key EV components, such that they can handlethe increased heat as the charging power increases.

For example, a PEV may use an onboard converter to manage the power flowfrom the charging station/power outlet/charger to the onboard batterycells/packs. When a level 3 charging station/power outlet/charger isimplemented to charge a PEV, the onboard converter require efficientthermal management through, for example, liquid cooling solutions. Asanother example, onboard vehicle battery cells/packs must be thermallymanaged during charging and operation to maximize their life andperformance, and liquid cooling solutions may provide the needed thermalmanagement. As another example, implementing liquid cooling solutions ina charging cable may reduce the weight of the charging cable so that itis easier for consumers to handle.

Example liquid cooling solutions in an EV may be in various forms thatall require a liquid coolant. For example, an example liquid coolingsolution may be in the form of an example indirect cooling system thatmay comprise a series of pipes in the onboard converter, onboard batterycells/packs, charging cables, and/or and other key EV components, andthe series of pipes may circulate liquid coolant. The liquid coolantabsorbs excess heat and carries it away to, for example, a heatexchanger. Example liquid coolant in an example indirect cooling systemmay include, but not limited to, water, glycol (such as, but not limitedto, ethylene glycol, propylene glycol), glycol-water mix,polyalphaolefin, fluorocarbon, and/or the like. As another example, anexample liquid cooling solution may be in the form of an example directcooling system, where liquid coolant is in direct contact with theonboard converter, onboard battery cells/packs, charging cables, and/orand other key EV components. In such an example, the liquid coolant maycomprise electrically insulating but thermally conductive material, suchas, but not limited to, deionized water, mineral oil, fluorocarbon,synthetic, and/or the like.

In various implementations of liquid cooling solutions, the pressure andtemperature of the liquid coolant needs to be measured and monitored.Many liquid cooling solutions provide separate pressure sensors andtemperature sensors, which are cost prohibitive and can add more weightto the EV/PEV, and manufacturers are in need of a compact sensorpackage. Using separate pressure sensors and temperature sensors notonly requires more space but also impacts the accuracy of readings.Further, many liquid cooling solutions fail to provide sufficientisolation of the pressure sensors and the temperature sensors from theliquid coolant, which can be corrosive and cause damages to the pressuresensors and the temperature sensor.

Various embodiments of the present disclosure may overcome varioustechnical deficiencies and problems, including but not limited to thosedescribed above. For example, an example apparatus for sensing pressureand temperature in accordance with example embodiments of the presentdisclosure may comprise a media isolation chamber assembly thatcomprises a bellows member housing various sensing elements andfunctioning similar to a diaphragm. Insulator media (such as, but notlimited to, silicon oil) may be filled with in the bellows member sothat the sensing elements are isolated from corrosive and/or wet media.In some embodiments, a temperature sensing element may be positionedwithin and at the end of the media isolation chamber assembly, so thatit can provide precise reading of temperature associated with the fluidsubstance to be measured. In some embodiments, a pressure sensingelement (such as, but not limited to, a MEMS pressure sensor) and thetemperature sensing element may be installed on a circuit board element(such as, but not limited to, a PCBA) that is disposed within the mediaisolation chamber assembly, and the circuit board element may carryother elements such as, but not limited to, signal conditioningelement(s) (such as, but not limited to, ASICs), signal amplifyingelement(s) and/or the like. In some embodiments, the circuit boardelement is connected to (for example, through soldering) to a terminalconnector element and provides electrical signals to another circuitboard element, which in turn provides electrical signals to anotherterminal connector element that extends outside the example apparatus.Further, example embodiments of the present disclosure provide a compactdesign of an electric circuit that provides separate outputs, onecorresponding to detected pressure and another corresponding to detectedtemperature, details of which are described herein.

As such, example embodiments of the present disclosure may provide acompact design that causes less thermal loss and improves accuracy ofthe pressure and temperature measurement, and/or may isolate sensingelements from corrosive and/or wet media to protect the sensingelements, details of which are described herein.

While the description provided herein illustrates implementing exampleembodiments of the present disclosure in electric vehicle chargingapplications, it is noted that the scope of the present disclosure isnot limited to these applications. In some examples, example embodimentsof the present disclosure may be implemented in otherapplications/environments/systems, including, but not limited to,refrigeration systems, compressor systems, pumping systems, and/or thelike.

Referring now to FIG. 1A and FIG. 1B, an example apparatus 100 forsensing pressure and temperature in accordance with various embodimentsof the present disclosure is illustrated. In particular, FIG. 1Aillustrates an example cross-sectional front view of the exampleapparatus 100. FIG. 1B illustrates an example cross-sectional side viewof the example apparatus 100 along the cut line A-A′ and viewing in thedirection of the arrows in FIG. 1A.

In the example shown in FIG. 1A, the example apparatus 100 comprises atleast an example media isolation chamber assembly 101, a first examplecircuit board element 103, an example pressure sensing element 105, andan example temperature sensing element 107.

In some embodiments, the example media isolation chamber assembly 101comprises an example bellows member 109 and an example sleeve member111.

In some embodiments, the example sleeve member 111 is in a shape similarto a hollow cylindrical shape. For example, the example sleeve member111 is in a shape similar to a right cylinder shape. In someembodiments, the example sleeve member 111 comprises an example bodyportion 113 having an example side section 115 and an example endsection 117.

In some embodiments, the example side section 115 of the example bodyportion 113 may be formed based on the points on the example sidesection 115 having a fixed distance from a central axis of the examplesleeve member 111. As described above, the example sleeve member 111 maybe in a shape similar to a hollow cylindrical shape, and the centralaxis of the example sleeve member 111 may correspond to the central axisof the hollow cylindrical shape.

In some embodiments, the example end section 117 of the example bodyportion 113 may be formed based on the example end section 117 being ina parapedicular arrangement with the example side section 115. Asdescribed above, the example sleeve member 111 may be in a shape similarto a hollow cylindrical shape, and the example end section 117 maycorrespond to an example end plane of the hollow cylindrical shape.

In the example shown in FIG. 1A, the example sleeve member 111 alsocomprises an example probe portion 119. In some embodiments, the exampleprobe portion 119 protrudes from an example outer surface of the exampleend section 117 of the example body portion 113 of the example sleevemember 111. In the example shown in FIG. 1A, the example probe portion119 may be in a shape similar to a half-capsule shape that comprises acylinder-shaped portion and a hemispherical end portion.

In some embodiments, the example probe portion 119 of the example sleevemember 111 is connected to the example body portion 113. For example,the example probe portion 119 may be formed on the example end section117 of the example body portion 113.

In some embodiments, the example sleeve member 111 may comprise materialsuch as, but not limited to, stainless steel, beryllium copper, phosphorbronze, metal alloys, and/or the like. In some embodiments, the examplesleeve member 111 may comprise other material(s). In some embodiments,the example sleeve member 111 may be formed through, for example but notlimited to, a deep drawing process.

While the description above provides an example of a sleeve member, itis noted that the scope of the present disclosure is not limited to thedescription above. In some examples, an example sleeve member maycomprise one or more additional and/or alternative elements, and/or maybe in other shapes/forms. For example, an example body portion of anexample sleeve member may be in shapes other than a hollow cylindricalshape, such as, but not limited to, a cube shape, a sphere shape, aprism shape, a cone shape, a pyramid shape, and/or the like.Additionally, or alternatively, an example probe portion of an examplesleeve member may be in shapes other than a half-capsule shape, such as,but not limited to, a cube shape, a sphere shape, a prism shape, a coneshape, a pyramid shape, and/or the like.

Referring back to the example shown in FIG. 1A, as described above, theexample media isolation chamber assembly 101 may comprise the examplebellows member 109. In some embodiments, the example bellows member 109acts as a diaphragm. In some embodiments, the example bellows member 109may be in the form of an elastic tube/tubing that can be compressed whenpressure is applied to the outer surface of the elastic tube/tubing,and/or may be extended when pressure that has been applied to the outersurface of the elastic tube/tubing is removed.

For example, the example bellows member 109 may be in the form of a tubeor tubing in a hollow cylindrical shape. In this example, the sidesection of the example bellows member 109 is corrugated and comprisesalternating ridges and grooves. When pressure is applied to the sidesection of the example bellows member 109, the example bellows member109 may be compressed. When pressure that has been applied to the sidesection of the example bellows member 109 is removed, the examplebellows member 109 may be extended.

In some embodiments, the example bellows member 109 may comprisematerial such as, but not limited to, stainless steel, beryllium copper,phosphor bronze, metal alloys, and/or the like. In some embodiments, theexample bellows member 109 may comprise other material(s).

In some embodiments, the example bellows member 109 may be formedthrough a welding process. For example, a number of individually formeddiagrams may be welded together to form alternating ridges and groovesof the example bellows member 109. Additionally, or alternatively, anexample bellows member 109 may be formed through a hydroforming process.Additionally, or alternatively, an example bellows member 109 may beformed through a deep drawing process. Additionally, or alternatively,an example bellows member 109 may be formed through an electroformingprocess. Additionally, or alternatively, an example bellows member 109may be formed through other manufacturing process(es).

In some embodiments, the example bellows member 109 is disposed in theexample sleeve member 111. For example, as described above, the examplebellows member 109 may be in a shape similar to a hollow cylindricalshape, and the example sleeve member 111 may be in a shape similar to ahollow cylindrical shape. In some embodiments, the example bellowsmember 109 is positioned within the example sleeve member 111, and thecentral axis of the example bellows member 109 is in a parallelarrangement with the central axis of the example sleeve member 111.

In some embodiments, the example bellows member 109 is disposed in theexample body portion 113 of the example sleeve member 111. In someembodiments, the example bellows member 109 is hermetically sealed tothe example body portion 113 of the example sleeve member 111. Forexample, an end edge of the example bellows member 109 is hermeticallysealed to the example end section 117 of the example body portion 113 ofthe example sleeve member 111, so that liquid substance and gaseoussubstance do not travel into the example bellows member 109 through theexample sleeve member 111.

In some embodiments, the example bellows member 109 is hermeticallysealed to the example sleeve member 111 through a welding process usinglaser. In some embodiments, the example bellows member 109 ishermetically sealed to the example sleeve member 111 through otherprocess(es).

In some embodiments, the example sleeve member 111 comprises at leastone media opening on its surface. In the example shown in FIG. 1A, theexample end section 117 of the example probe portion 119 of the examplesleeve member 111 comprises a media opening 120A and a media opening120B. In some embodiments, the media opening 120A and the media opening120B may be formed through a deep drawing process. In some embodiments,the media opening 120A and the media opening 120B may be formed throughother manufacturing process(es).

In some embodiments, the media opening(s) on the example end section 117of the example probe portion 119 of the example sleeve member 111 isconfigured to receive a liquid substance, and the pressure of the liquidsubstance is to be detected by the example apparatus 100. For example,the liquid substance may enter the example sleeve member 111 through theat least one media opening and fill the cavity formed between outersurface of the example bellows member 109 and the example body portion113 of the example sleeve member 111 (e.g. the inner surface opposite tothe example side section 115). The liquid substance may be in contactwith the outer surface of the example bellows member 109, but does notenter the example bellows member 109 because the example bellows member109 is hermetically sealed to the example sleeve member 111.

In some embodiments, the example bellows member 109 houses or otherwisecontains insulator media. In some embodiments, the insulator mediacomprises electrically insulating but thermally conductive material.Examples of insulator media may include, but not limited to, siliconoil, mineral oil, fluorocarbon, synthetic, and/or the like.

Referring back to the example shown in FIG. 1A, as described above, theexample apparatus 100 comprises the first example circuit board element103. As described above, the first example circuit board element 103 maybe in the form of an example PCB. In such an example, the first examplecircuit board element 103 comprises a non-conductive substrate andconductive tracks, pads and other features that are formed on thenon-conductive substrate (for example, through a chemical etchingprocess).

In some embodiments, one or more other elements (such as, but notlimited to, pressure sensing element(s), temperature sensing element(s),signal conditioning element(s), signal amplifying element(s), resistorelement(s), terminal connector element(s), power source(s), and/or thelike) are installed (for example, through a soldering process) onto thefirst example circuit board element 103 so that each of these elementsis electrically coupled to one or more other elements and mechanicallyfastened onto the first example circuit board element 103. For example,the example pressure sensing element 105 and/or example temperaturesensing element 107 are installed on the first example circuit boardelement 103. In some embodiments, one or more signal conditioningelement(s) and/or signal amplifying element(s) are installed on thefirst example circuit board element 103. Similar to those describedabove, the first example circuit board element 103 with elementsinstalled is also referred to as a first example PCBA.

In the example shown in FIG. 1A, the first example circuit board element103 is disposed in the example bellows member 109. In some embodiments,the first example circuit board element 103 extends from within theexample bellows member 109 to within the example probe portion 119 ofthe example sleeve member 111. In some embodiments, an edge of the firstexample circuit board element 103 is secured to an inner surface of theexample probe portion 119 of the example sleeve member 111 through, forexample but not limited to, a welding process.

In some embodiments, the first example circuit board element 103 isencapsulated by the insulator media. In some embodiments, the firstexample circuit board element 103 is completely submerged within theinsulator media (such as, but not limited to, silicon oil). In someembodiments, the first example circuit board element 103 is partiallysubmerged within the insulator media (such as, but not limited to,silicon oil). In some embodiments, the insulator media and the examplebellows member 109 protect the first example circuit board element 103(as well as other elements electrically coupled to the first examplecircuit board element 103) from corrosive and wet media (for example,the liquid substance entering through the media opening 120A and mediaopening 120B as described above).

Referring back to the example shown in FIG. 1A, as described above, theexample apparatus 100 comprises the example pressure sensing element105. As described above, the example pressure sensing element 105detects, senses, and/or measures the pressure of gaseous substanceand/or liquid substance. In some embodiments, the example pressuresensing element 105 in accordance with various embodiments of thepresent disclosure is a MEMS pressure sensing die that is built andpackaged using MEMS techniques, similar to those described above andillustrated in connection with FIG. 4 and FIG. 5.

Additionally, or alternatively, in some embodiments, the examplepressure sensing element 105 in accordance with example embodiments ofthe present disclosure is in the form of a MEMS capacitive pressuresensor. Additionally, or alternatively, in some embodiments, the examplepressure sensing element 105 in accordance with example embodiments ofthe present disclosure is in the form of a potentiometric pressuresensor. Additionally, or alternatively, in some embodiments, the examplepressure sensing element 105 in accordance with example embodiments ofthe present disclosure is in the form of an inductive pressure sensor.Additionally, or alternatively, in some embodiments, the examplepressure sensing element 105 in accordance with example embodiments ofthe present disclosure is in the form of a variable reluctance pressuresensor. Additionally, or alternatively, in some embodiments, an examplepressure sensing element may comprise one or more additional and/oralternative components and/or may be in one or more different form(s).

As described above, the example pressure sensing element 105 is disposedin the example bellows member 109 and submerged in and/or encapsulatedby the insulator media. As described above, liquid substance (whosepressure is to be measured by the apparatus 100) may enter the cavitybetween the example bellows member 109 and the example sleeve member 111through the media opening 120A and/or the media opening 120B, and theliquid substance is in contact with outer surface of the example bellowsmember 109. Further, as described above, the example bellows member 109acts as a diaphragm. For example, the example bellows member 109 may bein the form of an elastic tube/tubing that can be compressed whenpressure is applied to the outer surface of the elastic tube/tubing. Assuch, the pressure from the liquid substance may be transferred to theexample bellows member 109 as the liquid substance enters through themedia opening 120A and/or the media opening 120B. In some embodiments,the example bellows member 109 houses insulator media (such as siliconoil), and the pressure may be transferred through the insulator media(such as silicon oil) to the example pressure sensing element 105. Insome embodiments, the example pressure sensing element 105 generates anelectrical signal that corresponds to the pressure of the liquidsubstance.

In various embodiments of the present disclosure, an example pressuresensing element 105 measures one or more different types of pressure.For example, the example pressure sensing element 105 in accordance withexample embodiments of the present disclosure measures an absolutepressure of the liquid substance relative to a reference of zeropressure. Additionally, or alternatively, the example pressure sensingelement 105 in accordance with example embodiments of the presentdisclosure measures a pressure relative to the atmospheric pressure.Additionally, or alternatively, the example pressure sensing element 105in accordance with example embodiments of the present disclosuremeasures a pressure between two points in the flow of the liquid substance.

Referring back to the example shown in FIG. 1A, the example pressuresensing element 105 is electrically coupled to the first example circuitboard element 103. In such an example, the example pressure sensingelement 105 provides the electrical signal that corresponds to thepressure of the liquid substance to other elements of the exampleapparatus 100, details of which are described herein.

As described above, the example apparatus 100 comprises the exampletemperature sensing element 107. The example temperature sensing element107 detects, senses, and/or measures the temperature of gaseoussubstance and/or liquid substance. In some embodiments, the exampletemperature sensing element 107 in accordance with various embodimentsof the present disclosure is an example diode (for example, but notlimited to, an example P-N junction diode), similar to those describedabove. Additionally, or alternatively, the example temperature sensingelement 107 in accordance with example embodiments of the presentdisclosure is in the form of a thermocouple. Additionally, oralternatively, the example temperature sensing element 107 in accordancewith example embodiments of the present disclosure is in the form of aresistance temperature detector (RTD). Additionally, or alternatively,the example temperature sensing element 107 in accordance with exampleembodiments of the present disclosure is the form of a thermistor.Additionally, or alternatively, the example temperature sensing element107 in accordance with various embodiments of the present disclosure isa MEMS temperature sensing die that is built and packaged using MEMStechniques.

In some embodiments, the example temperature sensing element 107 isdisposed in the example sleeve member 111. In the example shown in FIG.1A, the example temperature sensing element 107 is disposed in theexample probe portion 119 of the example sleeve member 111. As theexample bellows member 109 is disposed in and hermetically sealed to theexample body portion 113 of the example sleeve member 111, the exampleprobe portion 119 of the example sleeve member 111 is connected to theexample bellows member 109, and both the example bellows member 109 andthe example probe portion 119 of the example sleeve member 111 house orotherwise contain isolation media. As such, the example temperaturesensing element 107 is submerged in and/or encapsulated by the insulatormedia (such as silicon oil).

In some embodiments, liquid substance (whose temperature is to bemeasured) is in contact with the example probe portion 119 of theexample sleeve member 111. Because the example temperature sensingelement 107 is disposed in the example probe portion 119 of the examplesleeve member 111, the example temperature sensing element 107 generatesan electrical signal that corresponds to the temperature of the liquidsubstance.

Referring back to the example shown in FIG. 1A, the example temperaturesensing element 107 is electrically coupled to the first example circuitboard element 103. In such an example, the example temperature sensingelement 107 provides an electrical signal that corresponds to thetemperature of the liquid substance to other elements of the exampleapparatus 100, details of which are described herein.

While the description above provides examples of pressure sensingelements and temperature sensing elements, it is noted that the scope ofthe present disclosure is not limited to the description above. In someexamples, a sensing element provides capability to measure both pressureand temperature (for example, a MEMS pressure sensing die havingtemperature measure options using a Zt diode), such that separatepressure sensing element and temperature sensing element are not needed.In such examples, the sensing element is positioned corresponding to theposition of the example pressure sensing element 105 illustrated in FIG.1A or corresponding to the position of the example temperature sensingelement 107 illustrated in FIG. 1A. An example apparatus comprising suchan example sensing element is illustrated and described in connectionwith at least FIG. 2A, FIG. 2B, and FIG. 2C.

Referring back to FIG. 1A, the example apparatus 100 comprises anexample port assembly 121. In some embodiments, the example mediaisolation chamber assembly 101 is secured to the example port assembly121. For example, an edge of the example sleeve member 111 of theexample media isolation chamber assembly 101 is secured to an outersurface 123 of the example port assembly 121 through, for example butnot limited to, a welding process. Additionally, or alternatively, anedge of the example bellows member 109 of the example media isolationchamber assembly 101 is secured to the outer surface 123 of the exampleport assembly 121 through, for example but not limited to, a weldingprocess.

In the example shown in FIG. 1A, the example port assembly 121 comprisesan example tunnel 125 that connects an example first opening 127 on theexample outer surface 123 of the example port assembly 121 to an examplesecond opening 129 on an inner surface of the example port assembly 121.In such an example, the example tunnel 125 is configured to convey theinsulator media (such as, but not limited to, silicon oil) to theexample bellows member 109 of the example media isolation chamberassembly 101 (as well as the example probe portion 119 of the examplesleeve member 111) through the example first opening 127 on the exampleouter surface 123 of the example port assembly 121.

For example, to inject the insulator media to the example bellows member109 of the example media isolation chamber assembly 101 and the exampleprobe portion 119 of the example sleeve member 111, the insulator mediais provided to the example second opening 129 on the inner surface ofthe example port assembly 121. The insulator media enters the exampletunnel 125 through the example second opening 129, travels through theexample tunnel 125, and egresses the example tunnel 125 through theexample first opening 127. In some embodiments, the example firstopening 127 is position within the example bellows member 109. As such,the insulator media is provided to the example bellows member 109.Because the example probe portion 119 of the example sleeve member 111is connected to the example bellows member 109, the insulator media isprovided to example probe portion 119 of the example sleeve member 111through the bellows member 109. Additionally, or alternatively, whenpressure is exerted on the example bellows member 109, the insulatormedia disposed within the example bellows member 109 is pushed throughthe example tunnel 125.

Referring back to the example shown in FIG. 1A, in some embodiments, theexample apparatus 100 also comprises an example sealing member 131 (forexample, a sealing ball) that covers the example second opening 129. Forexample, once the example bellows member 109 and the example probeportion 119 of the example sleeve member 111 are filled with insulatormedia, the example sealing member 131 is positioned on the examplesecond opening 129 to seal the example tunnel 125, such that theinsulator media does not leak from the example bellows member 109 or theexample probe portion 119 through the example tunnel 125.

In some embodiments, the example apparatus 100 comprises a secondexample circuit board element 133.

As described above, the second example circuit board element 133 may bein the form of an example PCB. In such an example, the second examplecircuit board element 133 comprises a non-conductive substrate andconductive tracks, pads and other features that are formed on thenon-conductive substrate (for example, through a chemical etchingprocess).

In some embodiments, one or more other elements (such as, but notlimited to, pressure sensing element(s), temperature sensing element(s),signal conditioning element(s), signal amplifying element(s), resistorelement(s), terminal connector element(s), power source(s), and/or thelike) are installed (for example, through a soldering process) onto thesecond example circuit board element 133 so that each of these elementsis electrically coupled to one or more other elements and mechanicallyfastened onto the second example circuit board element 133. For example,an example signal conditioning element and an example signal amplifyingelement is installed on the second example circuit board element 133.Similar to those described above, the second example circuit boardelement 133 with elements installed is also referred to as a secondexample PCBA.

In some embodiments, the second example circuit board element 133 isdisposed within the example port assembly 121. In some embodiments, theexample apparatus 100 comprises at least one terminal connector element(for example, a first example terminal connector element 135A and asecond example terminal connector element 135B) that electricallycouples the second example circuit board element 133 with the firstexample circuit board element 103. For example, various electricalsignals, data, and/or information are communicated between the secondexample circuit board element 133 and the first example circuit boardelement 103 through the first example terminal connector element 135Aand/or the second example terminal connector element 135B. In someembodiments, one end of the at least one terminal connector element (forexample, one end of the first example terminal connector element 135Aand/or one end of the second example terminal connector element 135B) issecured to the second example circuit board element 133 through, forexample but not limited to, a soldering process. In some embodiments,one end of the at least one terminal connector element (for example, oneend of the first example terminal connector element 135A and/or one endof the second example terminal connector element 135B) is secured tofirst example circuit board element 103 through, for example but notlimited to, a soldering process.

In the example shown in FIG. 1A, the example apparatus 100 comprises anexample header member 137 secured to the first example circuit boardelement 103 and the example port assembly 121. In some embodiments, theexample header member 137 may be in the form of a transistor outline(TO) header that provides a mechanical basis for securing and installingvarious elements. For example, the first example circuit board element103 is secured to the example header member 137 through, such as but notlimited to, a soldering process. In some embodiments, the example headermember 137 comprises a glass-to-metal seal portion 139 that secured thefirst example circuit board element 103 to the example header member137. In some embodiments, one or more of the at least one terminalconnector element (for example, the first example terminal connectorelement 135A and/or the second example terminal connector element 135B)passes through the glass-to-metal seal portion 139. In some embodiments,the example header member 137 is secured to the example port assembly121 through, for example but not limited to, a welding process.

In the example shown in FIG. 1A, the example port assembly 121 comprisesa threaded portion 141 disposed on the outer surface of the example portassembly 121. In some embodiments, the example apparatus 100 comprisesat least one connection wire 143 that electrically couples the secondexample circuit board element 133 to at least one example terminalconnector element 145. As shown in FIG. 1A, the at least one exampleterminal connector element 145 extends outside of the example apparatus100. In some embodiments, the example apparatus 100 comprises at leastone environmental O-ring 147 for sealing the example header member 137with the example port assembly 121. In some embodiments, the exampleapparatus 100 do not comprise O-ring or gasket.

While the description above provides an example apparatus 100 forsensing pressure and temperature, it is noted that the scope of thepresent disclosure is not limited to the description above. In someexamples, an example apparatus for sensing pressure and temperature inaccordance with examples of the present disclosure may comprise one ormore additional and/or alternative elements.

Referring now to FIG. 1B, an example cross-sectional view of the exampleapparatus 100 along the cut line A-A′ and viewing in the direction ofthe arrows in FIG. 1A is illustrated. In particular, FIG. 1B illustratesexample measurements associated with the example apparatus 100.

As shown in FIG. 1B, the example probe portion 119 of the example sleevemember 111 has a height H3 and a width W4 (which corresponds to adiameter of the example probe portion 119). In some embodiments, theheight H3 is in the range from 2 millimeters to 6 millimeters. In someembodiments, the height H3 is 4 millimeters. In some embodiments, thewidth W4 is in the range from 2 millimeters to 6 millimeters. In someembodiments, the width W4 is 4 millimeters.

In some embodiments, the example body portion 113 of the example sleevemember 111 has a width W3 (which corresponds to a diameter of theexample body portion 113). In some embodiments, the width W3 is in therange between 6 millimeters and 10 millimeters. In some embodiments, thewidth W3 is 8 millimeters. In some embodiments, the thickness of theexample body portion 113 of the example sleeve member 111 is in therange between 0.2 millimeters and 0.5 millimeters. In some embodiments,the thickness of the example body portion 113 is 0.25 millimeters.

In some embodiments, the example sleeve member 111 has a height H2. Insome embodiments, the height H2 is in the range between 10 millimetersand 20 millimeters. In some embodiments, the height H2 is 15millimeters.

In some embodiments, the example bellows member 109 has a width W1(which corresponds to a diameter of the example bellows member 109). Insome embodiments, the width W1 is in the range between 4 millimeters and8 millimeters. In some embodiments, the width W1 is 6 millimeters. Insome embodiments, the thickness of the example bellows member 109 is inthe range between 25 micrometers to 50 micrometers. In some embodiments,the thickness of the example bellows member 109 is 30 micrometers.

In some embodiments, the combined height H1 of the example mediaisolation chamber assembly 101 and the example port assembly 121 is inthe range between 20 millimeters and 40 millimeters. In someembodiments, the height H1 is 30 millimeters.

In some embodiments, the first example circuit board element 103 has athickness W2. In some embodiments, the thickness W2 is in the rangebetween 0.5 millimeters and 1.5 millimeters. In some embodiments, thethickness W2 is 1.0 millimeter.

Referring now to FIG. 2A, FIG. 2B, and FIG. 2C, an example apparatus 200for sensing pressure and temperature in accordance with variousembodiments of the present disclosure is illustrated. In particular,FIG. 2A illustrates an example front view of the example apparatus 200.FIG. 2B illustrates an example cross-sectional view of an example mediaisolation chamber assembly 206 of the example apparatus 200 along thecut line A-A′ and viewing in the direction of the arrows in FIG. 2A.FIG. 2C illustrates an example cross-sectional view of the example mediaisolation chamber assembly 206 of the example apparatus 200 along thecut line B-B′ and viewing in the direction of the arrows in FIG. 2B.

Referring now to FIG. 2A, the example apparatus 200 comprises an exampleheader member 202, an example port assembly 204, and an example mediaisolation chamber assembly 206. In some embodiments, the example headermember 202 is similar to the example header member 137 described abovein connection with FIG. 1A and FIG. 1B. In some embodiments, the exampleport assembly 204 is similar to the example port assembly 121 describedabove in connection with FIG. 1A and FIG. 1B. In some embodiments, theexample media isolation chamber assembly 206 is similar to the examplemedia isolation chamber assembly 101 described above in connection withFIG. 1A and FIG. 1B. For example, the example header member 202 issecured to the example port assembly 204. Additionally, oralternatively, the example media isolation chamber assembly 206 issecured to the example port assembly 204.

Referring now to FIGS. 2B and 2C, example cross-sectional views of theexample media isolation chamber assembly 206 of the example apparatus200 are illustrated.

As shown, the example media isolation chamber assembly 206 comprises anexample sleeve member 208. In some embodiments, the example sleevemember 208 may be in a shape similar to a half-capsule shape thatcomprises a cylinder-shaped portion and a hemispherical end portion. Insome embodiments, the width (which corresponds to a diameter) of theexample sleeve member 208 is in the range of 2 millimeters to 6millimeters. In some embodiments, the width of the example sleeve member208 is 4 millimeters. In some embodiments, the thickness of the examplesleeve member 208 is in the range of 0.3 millimeters to 0.7 millimeters.In some embodiments, the thickness of the example sleeve member 208 is0.5 millimeters.

In some embodiments, the example sleeve member 208 may comprise materialsuch as, but not limited to, stainless steel, beryllium copper, phosphorbronze, metal alloys, and/or the like. In some embodiments, the examplesleeve member 208 may comprise other material(s). In some embodiments,the example sleeve member 208 may be formed through, for example but notlimited to, a deep drawing process.

While the description above provides an example of a sleeve member, itis noted that the scope of the present disclosure is not limited to thedescription above. In some examples, an example sleeve member maycomprise one or more additional and/or alternative elements, and/or maybe in other shapes/forms. For example, an example sleeve member may bein shapes other than a half-capsule shape, such as, but not limited to,a cube shape, a sphere shape, a prism shape, a cone shape, a pyramidshape, and/or the like. Additionally, or alternatively, one or moremeasurements of the example sleeve member may be of other value(s).

In some embodiments, the example sleeve member 208 comprises at leastone media opening 210 on its surface. In some embodiments, the mediaopening(s) of the example sleeve member 208 is configured to receive aliquid substance, and the pressure of the liquid substance is to bedetected by the example apparatus 200.

In the example shown in FIG. 2B and FIG. 2C, the example media isolationchamber assembly 206 comprises an example diaphragm member 212. In someembodiments, the example diaphragm member 212 is disposed within theexample sleeve member 208, and the example sleeve member 208 provides anenclosure for the example diaphragm member 212. In some embodiments, theexample diaphragm member 212 comprises an example inner casing member214. In some embodiments, the example inner casing member 214 isdisposed within the example sleeve member 208. In some embodiments, theexample inner casing member 214 comprises one or more openings on itssurface.

In some embodiments, the example inner casing member 214 may be in ashape similar to a half-capsule shape that comprises a cylinder-shapedportion and a hemispherical end portion. In some embodiments, the width(which corresponds to a diameter) of the example inner casing member 214is in the range of 1.0 millimeter and 4.0 millimeters. In someembodiments, the width of the example inner casing member 214 is 3.5millimeters. In some embodiments, the thickness of the example innercasing member 214 is in the range of 0.2 millimeters to 0.3 millimeters.In some embodiments, the thickness of the example inner casing member214 is 0.25 millimeters.

In some embodiments, the example inner casing member 214 may comprisematerial such as, but not limited to, stainless steel, beryllium copper,phosphor bronze, metal alloys, and/or the like. In some embodiments, theexample inner casing member 214 may comprise other material(s). In someembodiments, the example inner casing member 214 may be formed through,for example but not limited to, a deep drawing process.

While the description above provides an example of an inner casingmember, it is noted that the scope of the present disclosure is notlimited to the description above. In some examples, an example innercasing member may comprise one or more additional and/or alternativeelements, and/or may be in other shapes/forms. For example, an exampleinner casing member may be in shapes other than a half-capsule shape,such as, but not limited to, a cube shape, a sphere shape, a prismshape, a cone shape, a pyramid shape, and/or the like. Additionally, oralternatively, one or more measurements of the example inner casingmember may be of other value(s).

In the example shown in FIG. 2B and FIG. 2C, an example membrane member216 is disposed on the outer surface of the example inner casing member214. In some embodiments, the example membrane member 216 comprises amembrane that is flexible and deforms when pressure is applied. In someembodiments, the example membrane member 216 may comprise material suchas, but not limited to, silicon.

In the example shown in FIG. 2B and FIG. 2C, the example diaphragmmember 212 comprises an example outer casing member 218.

In some embodiments, the example outer casing member 218 is disposedwithin the example sleeve member 208. In some embodiments, an edge ofthe example outer casing member 218 is secured to the example membranemember 216. For example, the example outer casing member 218 ishermetically sealed to the example membrane member 216,

In some embodiments, the example outer casing member 218 may be in ashape similar to a hollow cylindrical shape. In some embodiments, thewidth (which corresponds to a diameter) of the example outer casingmember 218 is in the range of 3.0 millimeters and 4.0 millimeters. Insome embodiments, the width of the example outer casing member 218 is 3millimeters. In some embodiments, the thickness of the example outercasing member 218 is in the range of 0.02 millimeters and 0.08millimeters. In some embodiments, the thickness of the example outercasing member 218 is 0.05 millimeters.

In some embodiments, the example outer casing member 218 may comprisematerial such as, but not limited to, stainless steel, beryllium copper,phosphor bronze, metal alloys, and/or the like. In some embodiments, theexample outer casing member 218 may comprise other material(s). In someembodiments, the example outer casing member 218 may be formed through,for example but not limited to, a deep drawing process.

While the description above provides an example of an outer casingmember, it is noted that the scope of the present disclosure is notlimited to the description above. In some examples, an example outercasing member may comprise one or more additional and/or alternativeelements, and/or may be in other shapes/forms. For example, an exampleouter casing member may be in shapes other than a hollow cylindricalshape, such as, but not limited to, a cube shape, a sphere shape, aprism shape, a cone shape, a pyramid shape, and/or the like.Additionally, or alternatively, one or more measurements of the exampleouter casing member may be of other value(s).

In the example shown in FIG. 2B and FIG. 2C, the example apparatus 200comprises an example circuit board element 224, similar to the firstexample circuit board element 103 described above in connection withFIG. 1A and FIG. 1B. In some embodiments, the example circuit boardelement 224 is disposed within the example inner casing member 214, andis secured to an inner surface of the example inner casing member 214through, for example but not limited to, a welding process. In someembodiments, the example circuit board element 224 comprises exampleconductive tracks 220 printed on the surface of the example circuitboard element 224.

In some embodiments, the example circuit board element 224 has a widthin the range of 1.0 millimeter to 3.0 millimeters. In some embodiments,the example circuit board element 224 has a width of 2.0 millimeters. Insome embodiments, the example circuit board element 224 has a thicknessin the range of 0.5 millimeters to 1.5 millimeters. In some embodiments,the example circuit board element 224 has a width of 1.0 millimeter.

In some embodiments, the example inner casing member 214 houses orotherwise contains insulator media 226. In some embodiments, theinsulator media 226 comprises electrically insulating but thermallyconductive material. Examples of insulator media 226 may include, butnot limited to, silicon oil, mineral oil, fluorocarbon, synthetic,and/or the like. As such, the example circuit board element 224 is fullysubmerged in and/or encapsulated by the insulator media 226 (such assilicon oil). In some embodiments, the example circuit board element 224is partially submerged in the insulator media 226 (such as silicon oil).

In the example shown in FIG. 2B and FIG. 2C, the example apparatus 200comprises an example sensing element 222. In some embodiments, theexample sensing element 222 is electrically coupled and secured to theexample circuit board element 224. For example, the example sensingelement 222 is electrically coupled to the one or more conductive tracksprinted on the example circuit board element 224. In some embodiments,the example sensing element 222 is fully submerged in and/orencapsulated by the insulator media 226 (such as silicon oil). In someembodiments, the example sensing element 222 is partially submerged inthe insulator media 226 (such as silicon oil).

In some examples, the example sensing element 222 provides capability tomeasure both pressure and temperature (for example, a MEMS pressuresensing die having temperature measure options using a Zt diode). Insome embodiments, liquid substance (whose pressure is to be measured bythe apparatus 200) may enter the cavity between the example sleevemember 208 and the example outer casing member 218 through the at leastone media opening 210, and the liquid substance may be in contact withouter surface of the example membrane member 216. As described above,the example membrane member 216 comprises a membrane that is flexibleand deforms when pressure is applied. As such, the pressure from theliquid substance is transferred to the example sensing element 222through the example membrane member 216 and the example insulator media226, and the example sensing element 222 generates an electrical signalcorresponding to the pressure of the liquid substance. Additionally, thetemperature of the liquid substance is transferred through the examplemembrane member 216 and the example insulator media 226, and the examplesensing element 222 generates an electrical signal corresponding to thetemperature of the liquid substance.

Referring now to FIG. 3, an example circuit diagram 300 in accordancewith various embodiments of the present disclosure is illustrated.

In some embodiments, the example circuit diagram 300 corresponds to anexample circuit that is printed on the first example circuit boardelement in accordance with various embodiments of the present disclosure(for example, the first example circuit board element 103 illustratedand described above in connection with FIG. 1A and FIG. 1B). In someembodiments, the example circuit diagram 300 corresponds to a combinedcircuit that includes a first circuit printed on the first examplecircuit board element in accordance with various embodiments of thepresent disclosure (for example, the first example circuit board element103 illustrated and described above in connection with FIG. 1A and FIG.1B) and a second circuit printed on the second example circuit boardelement in accordance with example embodiments of the present disclosure(for example, the second example circuit board element 133 illustratedand described above in connection with FIG. 1A and FIG. 1B).

For example, as described above, an example pressure sensing element(for example, the example pressure sensing element 105 illustrated anddescribed above in connection with FIG. 1A, FIG. 1B, FIG. 4 and/or FIG.5) is electrically coupled to a first circuit board element (forexample, the first example circuit board element 103 illustrated anddescribed above in connection with FIG. 1A and FIG. 1B). In the examplecircuit diagram 300, the example pressure sensing element is depicted aspressure sensing element 301. In some embodiments, the pressure sensingelement 301 receives an excitation voltage V_(in) and is electricallycoupled to the ground. In some embodiments, the excitation voltageV_(in) is within the range of 2.7 V to 40 V. In some embodiments, theexcitation voltage V_(in) is 5 V. In some embodiments, the pressuresensing element 301 generates an electrical signal corresponding to thedetected pressure (for example, an electrical voltage that correspondsto the detected pressure).

In some embodiments, the first circuit board element comprises anexample signal conditioning element, which is depicted as the signalconditioning element 305 in the example circuit diagram 300. As shown inFIG. 3, the pressure sensing element 301 is electrically coupled to thesignal conditioning element 305 and provides the electrical signalcorresponding to the detected pressure to the signal conditioningelement 305.

In some embodiments, the signal conditioning element 305 is in the formof an example ASIC as described above. In some embodiments, the signalconditioning element 305 receives an excitation voltage V_(in) and iselectrically coupled to the ground. In some embodiments, the excitationvoltage V_(in) is within the range of 2.7 V to 40 V. In someembodiments, the excitation voltage V_(in) is 5 V. In some embodiments,the signal conditioning element 305 is configured to provide signalconditioning function on the electrical signal received from thepressure sensing element 301, and output an electrical signal P_(out)that has been conditioned and represents a detected pressure. In someembodiments, the signal conditioning element 305 in accordance withvarious embodiments of the present disclosure is an example ASIC. Insome embodiments, the example ASIC may include one or moremicroprocessors electrically coupled to one or more memory units (suchas, but not limited to, RAM, ROM, flash memory, and/or the like). Insome embodiments, the one or more microprocessors of the example ASICadjust, manipulate, and/or otherwise condition the electrical signalreceived from the pressure sensing element 301, and output theadjusted/manipulated/conditioned signal as P_(out).

Further, as described above, an example temperature sensing element (forexample, the example temperature sensing element 107 illustrated anddescribed above in connection with FIG. 1A and FIG. 1B) is electricallycoupled to a first circuit board element (for example, the first examplecircuit board element 103 illustrated and described above in connectionwith FIG. 1A and FIG. 1B). In the example circuit diagram 300, theexample temperature sensing element is depicted as temperature sensingelement 303. In some embodiments, the temperature sensing element 303generates an electrical signal corresponding to the detectedtemperature.

In some embodiments, the first circuit board element comprises anexample signal amplifying element, which is depicted as the signalamplifying element 307 in the example circuit diagram 300. As shown inFIG. 3, the temperature sensing element 303 is electrically coupled tothe signal amplifying element 307 and provides the electrical signalcorresponding to the detected temperature to the signal amplifyingelement 307. For example, the signal amplifying element 307 is anexample INA. In such embodiments, the signal amplifying element 307comprises three operational amplifiers, where a non-inverting amplifieris connected to each input of a differential amplifier

In some embodiments, the first circuit board element comprises anexample resistor element 309. As shown in FIG. 3, the example resistorelement 309 is electrically coupled to the temperature sensing element303 and is electrically coupled to the signal amplifying element 307. Insome embodiments, the example resistor element 309 receives anexcitation voltage V_(in). In some embodiments, the excitation voltageV_(in) is within the range of 5 V to 40 V. In some embodiments, theexcitation voltage V_(in) is 5 V.

In some embodiments, the temperature coefficient of the exampletemperature sensing element 303 is 2 mV/° C. For example, when thedetected temperature increases, the voltage across example temperaturesensing element 303 decreases. When the detected temperature decreases,the voltage across example temperature sensing element 303 increases.The differential voltage may further be scaled by the example resistorelement 309, so that the voltage across the example temperature sensingelement 303 is from 0.57 V to 1 V when the detected temperature is from−40° C. to 125° C. In some embodiments, the signal amplifying element307 further amplifies the output to within the range of 0 V to 5 V.

In some embodiments, the signal amplifying element 307 receives anexcitation voltage V_(in) and is electrically coupled to the ground. Insome embodiments, the excitation voltage V_(in) is within the range of2.7 V to 40 V. In some embodiments, the excitation voltage V_(in) is 5V. In some embodiments, the signal amplifying element 307 is configuredto provide signal amplifying function on the electrical signal receivedfrom the temperature sensing element 303, and output an electricalsignal T_(out) that has been amplified and represents a detectedtemperature.

As such, in accordance with various embodiments of the presentdisclosure, an electric circuit of an example apparatus is configured tooutput a first electrical signal (for example, P_(ont)) indicating adetected pressure and a second electrical signal (for example, T_(out))indicating a detected temperature.

It is to be understood that the disclosure is not to be limited to thespecific embodiments disclosed, and that modifications and otherembodiments are intended to be included within the scope of the appendedclaims. Although specific terms are employed herein, they are used in ageneric and descriptive sense only and not for purposes of limitation,unless described otherwise.

1. An apparatus for sensing pressure and temperature comprising: a mediaisolation chamber assembly comprising a sleeve member and a bellowsmember, wherein the bellows member is disposed in the sleeve member andhouses insulator media; a first circuit board element disposed in thebellows member and encapsulated by the insulator media; a pressuresensing element disposed in the bellows member and electrically coupledto the first circuit board element; and a temperature sensing elementdisposed in the sleeve member and electrically coupled to the firstcircuit board element.
 2. The apparatus of claim 1, wherein the bellowsmember is hermetically sealed to the sleeve member.
 3. The apparatus ofclaim 1, wherein the sleeve member comprises a body portion and a probeportion, wherein the body portion comprises a side section and an endsection, wherein the side section is in a perpendicular arrangement withthe end section.
 4. The apparatus of claim 3, wherein the probe portionprotrudes from an outer surface of the end section of the body portionof the sleeve member.
 5. The apparatus of claim 3, wherein thetemperature sensing element is disposed in the probe portion of thesleeve member.
 6. The apparatus of claim 3, wherein the bellows memberis disposed in the body portion of the sleeve member.
 7. The apparatusof claim 6, wherein the end section comprises at least one media openingthat is configured to receive a liquid substance so that the liquidsubstance is in contact with the bellows member.
 8. The apparatus ofclaim 5, wherein the first circuit board element extends from within thebellows member to within the probe portion of the sleeve member.
 9. Theapparatus of claim 1 further comprising: a port assembly, wherein thesleeve member of the media isolation chamber assembly is secured to anouter surface of the port assembly.
 10. The apparatus of claim 9,wherein the port assembly further comprises a tunnel connecting a firstopening on the outer surface of the port assembly to a second opening onan inner surface of the port assembly.
 11. The apparatus of claim 10,wherein the tunnel is configured to convey the insulator media to thebellows member of the media isolation chamber assembly through the firstopening on the outer surface of the port assembly.
 12. The apparatus ofclaim 10 further comprising: a sealing member covering the secondopening on the inner surface of the port assembly.
 13. The apparatus ofclaim 9 further comprising: a second circuit board element disposedwithin the port assembly; and at least one terminal connector elementelectrically coupling the first circuit board element to the secondcircuit board element.
 14. The apparatus of claim 13 further comprising:a header member comprising a glass-to-metal seal portion and secured tothe first circuit board element and the port assembly.
 15. The apparatusof claim 1, wherein the first circuit board element comprises a signalconditioning element, wherein the pressure sensing element iselectronically coupled to the signal conditioning element.
 16. Theapparatus of claim 15, wherein the signal conditioning element isconfigured to output an electrical signal indicating a detectedpressure.
 17. The apparatus of claim 15, wherein the first circuit boardelement comprises an signal amplifying element, wherein the temperaturesensing element is electrically coupled to the signal amplifyingelement.
 18. The apparatus of claim 17, wherein the first circuit boardelement comprises a resistor element, wherein the resistor element iselectrically coupled to the temperature sensing element and the signalamplifying element.
 19. The apparatus of claim 18, wherein the signalamplifying element is configured to output an electrical signalindicating a detected temperature.
 20. The apparatus of claim 1, whereinthe first circuit board element is configured to output a firstelectrical signal indicating a detected pressure and a second electricalsignal indicating a detected temperature.